发明名称 |
Sputtering apparatus, method of operating the same, and method of manufacturing substrate using the same |
摘要 |
A sputtering apparatus includes a susceptor for receiving a substrate, and a first target device disposed to be opposite to a center region of a substrate and at least second and third target devices disposed to be opposite to peripheral regions of the substrate, wherein the second and third target devices are rotatable.
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申请公布号 |
US8052850(B2) |
申请公布日期 |
2011.11.08 |
申请号 |
US20070802174 |
申请日期 |
2007.05.21 |
申请人 |
LG DISPLAY CO., LTD.;AVACO CO., LTD.;LG ELECTRONCS INC. |
发明人 |
LIM TAE HYUN;YOO HWAN KYU;YUN BYUNG HAN |
分类号 |
C23C14/34 |
主分类号 |
C23C14/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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