发明名称 |
Light sensor receiving light from backside |
摘要 |
The invention is directed to enhancement of performance of a back surface incident type semiconductor device having a light receiving element and a manufacturing method thereof without increasing a manufacturing cost. A supporting body is attached to a front surface of a semiconductor substrate formed with a light receiving element and its pad electrode. Then, the supporting body is etched to form a via hole penetrating the supporting body and exposing the pad electrode. Then, a wiring connected to the pad electrode and extending onto a front surface of the supporting body through the via hole is formed. Lastly, the semiconductor substrate is separated into a plurality of semiconductor dies by dicing. The semiconductor device is mounted so that the supporting body faces a circuit board.
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申请公布号 |
US8053852(B2) |
申请公布日期 |
2011.11.08 |
申请号 |
US20060483185 |
申请日期 |
2006.07.10 |
申请人 |
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
发明人 |
NOMA TAKASHI |
分类号 |
H01L27/14;H01L23/12;H01L27/148;H01L31/02;H04N5/335;H04N5/369;H04N5/372 |
主分类号 |
H01L27/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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