发明名称 |
Integration of open space/dummy metal at CAD for physical debug of new silicon |
摘要 |
An access pad is used to provide access to a functional block of an integrated circuit (IC) device. The access pad is formed using dummy metal in an open space in a metallization level that is between a top metallization level and a base level on which the functional block is formed in the IC device. The access pad at the metallization level provides a contact to access an underlying circuit of the functional block so that the functional integrity of the functional block of the IC device can be verified during probing.
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申请公布号 |
US8056025(B1) |
申请公布日期 |
2011.11.08 |
申请号 |
US20080035403 |
申请日期 |
2008.02.21 |
申请人 |
ALTERA CORPORATION |
发明人 |
CHOWDHURY VIJAY;HSU CHE TA;YU ADA |
分类号 |
G06F17/50;G01R31/28;G06F19/00 |
主分类号 |
G06F17/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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