发明名称 |
Light source module, backlight assembly having the same, display apparatus having the backlight assembly, and method thereof |
摘要 |
A light source module includes a power supply plate, a light emitting chip, and a body mold. The light emitting chip is disposed on the power supply plate to lean to one side with respect to a center of the power supply plate along a first direction and electrically connected to the power supply plate. The body mold is connected with the power supply plate to expose the light emitting chip. Therefore, a thickness of a backlight assembly employing the light source module may be reduced.
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申请公布号 |
US8053968(B2) |
申请公布日期 |
2011.11.08 |
申请号 |
US20080110486 |
申请日期 |
2008.04.28 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
WOO SEUNG-GYUN;CHU YOUNG-BEE;LEE IK-SOO |
分类号 |
H05B33/04;F21S2/00;F21V8/00;F21V23/00;F21Y101/02;G02F1/13357;H05B37/02 |
主分类号 |
H05B33/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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