发明名称 |
Microfins for cooling an ultramobile device |
摘要 |
The present invention discloses a method of cooling an ultramobile device with microfins attached to an external wall of an enclosure surrounding the ultramobile device.
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申请公布号 |
US8054629(B2) |
申请公布日期 |
2011.11.08 |
申请号 |
US20080286708 |
申请日期 |
2008.09.30 |
申请人 |
INTEL CORPORATION |
发明人 |
LI ZHIHUA;HSIEH CHENG-CHIEH;HU XUEJIAO;ERTURK HAKAN;CHEN GEORGE |
分类号 |
H05K7/20;F28F7/00;H01L23/34 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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