发明名称 |
Characterizing thermomechanical properties of an organic substrate using three-dimensional finite element analysis |
摘要 |
A method for characterizing thermomechanical properties of an organic substrate includes the steps of: receiving an image of the substrate, the image including a geometric description of the circuit layers of the substrate; selecting a given one of the circuit layers for processing; converting the image to a 2-D FEM image of the given circuit layer; repeating the steps of selecting a given one of the circuit layers and converting the image to a 2-D FEM image of the selected layer until all of the layers have been processed; combining all of the 2-D FEM images corresponding to the layers to form a 3-D FEM image representing at least a portion of the substrate; determining a coefficient of thermal expansion (CTE), modulus and/or Poisson's ratio of the 3-D FEM image; and constructing a 3-D representation of the substrate as a function of the CTE, modulus and/or Poisson's ratio of the 3-D FEM image.
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申请公布号 |
US8056027(B2) |
申请公布日期 |
2011.11.08 |
申请号 |
US20080260718 |
申请日期 |
2008.10.29 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
DANG HIEN PHU;KHANNA VIJAVESHWAR DAS;SHARMA ARUN;SRI-JAYANTHA SRI M. |
分类号 |
G06F17/50;G06K9/00 |
主分类号 |
G06F17/50 |
代理机构 |
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地址 |
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