发明名称 Dustproof structure for slide type electronic device and slide type electronic device
摘要 There are a first packing 31 and a second packing 32 for covering and sealing a first opening portion 11a and a second opening portion 12a other than a groove portion 31a and a groove portion 32a for leading an FPC 20. The first packing 31 and the second packing 32 wipe surfaces of the FPC 20 coming in and going out of the groove portion 31a and the groove portion 32a by sliding operation of a second frame 12.
申请公布号 US8055315(B2) 申请公布日期 2011.11.08
申请号 US20070281370 申请日期 2007.02.22
申请人 NEC CORPORATION 发明人 KOMIYAMA TAKEHIKO
分类号 H04M1/00 主分类号 H04M1/00
代理机构 代理人
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