发明名称 SOI body contact using E-DRAM technology
摘要 A semiconductor structure is disclosed. The semiconductor structure includes an active semiconductor layer, a semiconductor device having a gate disposed on top of the active semiconductor layer, and source and drain regions and a body/channel region disposed within the active semiconductor layer, an insulator layer having a first and second side, the first side being adjacent to the active semiconductor layer, a substrate disposed adjacent to the second side of the insulator layer, a body contact disposed under the body/channel region and in the insulator layer. The body contact electrically connects with and contacts with the body/channel region of the semiconductor device and the substrate, to thereby form an ohmic contact and to eliminate floating body effects.
申请公布号 US8053303(B2) 申请公布日期 2011.11.08
申请号 US201113075552 申请日期 2011.03.30
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 BARTH, JR. JOHN E.;BERNSTEIN KERRY;WHITE FRANCIS R.
分类号 H01L21/8238 主分类号 H01L21/8238
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