AN ETCHING SOLUTION COMPOSITION FOR METAL LAYER COMPRISING COPPER AND TITANIUM

摘要

PURPOSE: An etching composition for metal layer including copper and titanium is provided to rapidly etch copper even though the hydrogen peroxide and oxone are not included. CONSTITUTION: An etching composition for metal layer including copper and titanium comprises persulfate 5~20 weight%, fluorine containing compound 0.01~2 A weight%, inorganic acid salt and their mixture over one kind rest selected between the inorganic acid 1~10 weight%, ring-shaped amine compound 0.3~5 weight%, chlorine compound 0.1~5 weight%, p-toluene sulfonic acid 0.1~5 weight%, and the water. The persulfate is selected in the group consisting of the ammonium persulfate, persulfate minor and the potassium persulphate.