SEMICONDUCTOR DEVICE

摘要

PURPOSE: A semiconductor device is provided to implement high speed and high efficiency by reducing parasitic inductance component in a wire inside and outside a package. CONSTITUTION: In a semiconductor device, a fist die pad(7a1) has a first lead which is used as the input of a DC-DC converter. A second die pad(7a2) has a second lead which is used as the output of the DC-DC converter. A third die pad(7a3) has a third lead. A fourth lead supplies a ground voltage to the DC-DC converter. A first semiconductor chip(5a) comprises a high side MOSFET of the DC-DC converter A second semiconductor chip(5b) comprises the low side MOSFET of the DC-DC converter A third semiconductor chip(5c) has a first driver circuit and a second driver circuit. The first driver circuit drives the high side MOSFET. The second driver circuit drives the low side MOSFET.