| 摘要 |
<P>PROBLEM TO BE SOLVED: To efficiently suck up solder at a time when an ON-operation for a solder suction switch is completed. <P>SOLUTION: A diaphragm type pump (vacuum pump) is driven by a motor to suck air in a vacuum tank, a nozzle (solder suction nozzle with a heater) 41 is connected to a suction side of the vacuum tank via an air passage 43, and the solder of molten state is sucked by the nozzle 41. An opening and closing valve 51 for opening and closing the air passage 43 is arranged in the midway part of the air passage 43. The solder suction switch 44 for starting the suction of the solder of molten state drives the motor at first, and opens and closes the opening and closing valve 51 after drive-starting the motor. <P>COPYRIGHT: (C)2012,JPO&INPIT |
