INSPECTING METHOD AND INSPECTING DEVICE

摘要

PROBLEM TO BE SOLVED: To solve the problem that it is difficult to grasp occurrence tendency of a defect since a defect size becoming fatal is miniaturized with miniaturization of a pattern and manufacturing tolerance which is originally not a defect is detected when sensitivity of a fault inspecting device is improved for detecting the minimal defect in a semiconductor manufacturing process.

SOLUTION: In the method for inspecting an object to be inspected, a designated part of the object to be inspected is image-picked up by using an image pickup means. The defect is detected from the picked up image, and a circuit pattern is recognized from the picked up image. A feature amount on image shade and a shape is calculated from the detected defect. A feature amount on image shade and a shape is calculated from the recognized circuit pattern. A specified defect or circuit pattern is filtered and extracted from the detected defect and the recognized circuit pattern. The mapping feature amount is decided from the feature amount of the specified defect or circuit pattern extracted by filtering. A distribution situation of the decided feature amount is displayed on a screen in a mapping format.

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