| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic device and manufacturing method thereof which can sufficiently maintain durability even when placed under an environment with a large temperature change. <P>SOLUTION: An electronic device 100 includes a first substrate 1, a second substrate 2 disposed opposite to the first substrate 1, a part 3 to be sealed disposed between the first substrate 1 and the second substrate 2, and a sealing part 4 joining the first substrate 1 and the second substrate 2 together and provided in a periphery of the part 3 to be sealed, having outer resin sealing parts 4a by which at least a part along the periphery of the part 3 to be sealed of the sealing part 4 is fixed to each of the first substrate 1 and the second substrate 2, and an intermediate resin sealing part 4b disposed so as to be interposed by the outer resin sealing parts 4a between the first substrate 1 and the second substrate 2. The outer resin sealing parts 4a and the intermediate resin sealing part 4b contain resin, and a melting point of the intermediate resin sealing part 4b is lower than a melting point of the outer resin sealing parts 4a. <P>COPYRIGHT: (C)2012,JPO&INPIT |
