| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for improving heat release of a substrate without a heat-release member attached thereto with intermediate members such as grease. <P>SOLUTION: A substrate body 3 mounting an electronic component 2 therein and a heat-release accelerating section 4 accelerating heat release of the substrate body 3 are formed together. The heat-release accelerating section 4 is formed on the external surface of the substrate body 3. The electronic component 2 is to be mounted on a surface 3a of the substrate body 3, and the heat-release accelerating section 4 is to be formed on a rear face 3b of the substrate body 3. A cooling channel 9 passing a cooling medium for cooling is formed in the heat-release accelerating section 4. <P>COPYRIGHT: (C)2012,JPO&INPIT |
