发明名称 SUBSTRATE PROCESSING APPARATUS AND COATING DEVELOPMENT SYSTEM EQUIPPED WITH THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which drops chemical liquid onto the substrate and processes the substrate by rotating the substrate, and reduces suspended mist without disturbing the environment in the substrate processing apparatus, and a coating development system comprising the same. <P>SOLUTION: A substrate processing apparatus is disclosed which drops liquid onto the substrate and processes the substrate by rotating the substrate. The substrate processing apparatus comprises a substrate holding part supporting the back face of the substrate, a substrate rotating part rotating the substrate holding part, a chemical liquid dropping part dropping chemical liquid onto the substrate supported by the substrate holding part, a recessed cup part surrounding the substrate supported by the substrate holding part, a suction port placed between the substrate supported by the substrate holding part and the inner peripheral surface of the cup, and a gas discharging part driven by the substrate rotating part and discharging the gas sucked through the suction port by communicating with the suction port into the lower side of the space of the substrate holding part. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011222685(A) 申请公布日期 2011.11.04
申请号 JP20100089235 申请日期 2010.04.08
申请人 TOKYO ELECTRON LTD 发明人 SHIBATA TAKESHI
分类号 H01L21/027;B05C9/08;H01L21/304 主分类号 H01L21/027
代理机构 代理人
主权项
地址