| 摘要 |
<P>PROBLEM TO BE SOLVED: To decrease the stress on a circuit board. <P>SOLUTION: An electronic device 1 comprises a housing 5, a circuit board 21 housed in the housing 5, a first back plate 51 attached to the circuit board 21, a second back plate 52 attached to the circuit board 21, and a connecting part 53 connecting the first back plate 51 and the second back plate 52. <P>COPYRIGHT: (C)2012,JPO&INPIT |
