CIRCUIT BOARD, SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING CIRCUIT BOARD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a circuit board capable of suppressing occurrence of deflection.

SOLUTION: In a circuit board 1, the average linear expansion coefficient (A) of a first insulator layer 21 in the substrate in-plane direction between 25°C and glass transition point is 3-30 ppm/°C. Furthermore, the average linear expansion coefficient (B) of a second insulator layer 23 in the substrate in-plane direction between 25°C and glass transition point is equal to the average linear expansion coefficient (C) of a third insulator layer 25 in the substrate in-plane direction between 25°C and glass transition point. (B) and (C) are larger than (A), and the difference between (A) and (B) as well as between (A) and (C) are 5-35 ppm/°C.

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