| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition the cured product of which has flame retardancy without use of a flame retardant such as a halogen compound, an antimony compound, and a phosphorus compound, and which has excellent flowability and heat resistance, and to provide a semiconductor device. <P>SOLUTION: The modified epoxy resin is obtained by epoxidizing a mixture including: polycondensate (a) made from dicyclopentadiene, phenol and/or cresol; and a bisphenol (b). The bisphenol (b) is preferably a compound represented by formula (1) (wherein a plurality of R's are each independently a hydrogen atom, or a methyl group), or formula (2) (wherein a plurality of R's are each independently a hydrogen atom, or a methyl group). <P>COPYRIGHT: (C)2012,JPO&INPIT |
