Cu-Si-Co ALLOY FOR ELECTRONIC MATERIAL, AND METHOD FOR PRODUCING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a Cu-Co-Si alloy which has improved balance between electrical conductivity and strength.

SOLUTION: The copper alloy for electronic materials contains 0.5-4.0 mass% of Co and 0.1-1.2 mass% of Si with the balance Cu and inevitable impurities, wherein the mass ratio of Co to Si (Co/Si) is 3.5≤Co/Si≤5.5, the area ratio of discontinuous precipitation (DP) cells is 5% or less and the average maximum width of the discontinuous precipitation (DP) cells is 2 μm or less.

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