| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a film for chip protection capable of reducing a warpage of a semiconductor device at the wafer level by correcting a warpage of a wafer after resin sealing, in addition to the function for protecting the rear surface of a semiconductor chip mounted by a face-down method. <P>SOLUTION: A film for chip protection 10 is used in a resin sealing type semiconductor device that uses WL-CSP technology. The film for chip protection 10 contains (A) a binder polymer component, (B) an epoxy resin, (C) a hardening agent for the epoxy resin, (D) silica, and (E) a dye and/or pigment as essential components. It has a curable protection film formation layer 12 in which the content of (D) silica is 50-80 mass% of the whole, and mass ratio [(B)/(A)] of (B) the epoxy resin to (A) the binder polymer component is within the range of 4-7. <P>COPYRIGHT: (C)2012,JPO&INPIT |
