| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an expansion suppressing composition for suppressing expansion of a substrate layer containing a thermoplastic resin, and to provide a multilayer structure using the expansion suppressing composition, and to provide a method for producing the multilayer structure. <P>SOLUTION: The expansion suppressing composition for a substrate layer is subjected to heat treatment and/or irradiation treatment on the substrate layer containing a thermoplastic resin, and contains a reactive compound and an inorganic sheet compound. The multilayer structure includes a substrate layer containing a thermoplastic resin and an expansion suppressing layer containing the above expansion suppressing composition subjected to heat treatment and/or irradiation treatment with light on the substrate layer. <P>COPYRIGHT: (C)2012,JPO&INPIT |
