| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition with which a pattern which is excellent in terms of adhesion to a substrate is obtained. <P>SOLUTION: A photosensitive resin composition includes a resin, a photopolymerizable compound, a photopolymerization initiator, a thioxanthone compound and a solvent. The photopolymerization initiator includes an alpha-amino ketone compound, a biimidazole compound and an oxime compound. The content of the thioxanthone compound is 80 to 160 parts by mass with respect to the content of the alpha-amino ketone compound of 100 parts by mass. <P>COPYRIGHT: (C)2012,JPO&INPIT |
