| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a photosensitive resin composition, a photosensitive element and a print circuit board which can obtain a sufficient geometric followability and strippability when a resist is formed on a surface resin layer with a plating resist to be used in gold plating on a circuit of a circuit formation board and the like having a surface resin layer such as a solder resist. <P>SOLUTION: A photosensitive resin composition contains: (A) component:binder polymer; (B) component:photo polymerizable compound; and (C) component:photoinitiator, which includes a weight average molecular weight of 80,000 to 120,000 of binder polymer composed of a 20 to 30% by mass of (meth)acrylic acid and a 70 to 80% by mass of (meth)acrylic acid alkyl ester as (A)component, and includes bisphenol A-based (meth)acrylate compound, alkoxylated trimethylolpropane tri(meth)acrylate compound and nonylphenylpolyalkylene glycol (meth)acrylate compound as (B) component. <P>COPYRIGHT: (C)2012,JPO&INPIT |
