| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device of high reliability by preventing failures such as insufficient welding points and distortion when welding a can to a base. <P>SOLUTION: In a semiconductor device 101, a laser diode element 102 and a photodiode element 104 are mounted on a base 109. A can 110 is provided to cover the laser diode element 102, the photodiode element 104, and wires 108a and 108b. In the can 110, a flange part 112 is secured on a main surface of the base 109 by joining with an organic coat 113. The organic coat 113 is such film as organic molecules 200 are arrayed on the surface of the flange part 112 by self organization. <P>COPYRIGHT: (C)2012,JPO&INPIT |
