JOINING METHOD OF FLIP CHIP USING MULTI-LAYER ADHESIVE

摘要

PURPOSE: A method for bonding a flip chip using a plurality of bonding layers is provided to being applied to various processes depending on a situation by variously changing a lamination sequence according to the kind and the need of a process. CONSTITUTION: A substrate is prepared to bond a chip(S1). A first adhesive layer of a layer structure is formed on the substrate(S2). The second adhesive layer of the layer structure is formed on the first adhesive layer(S3). The chip is transferred to be placed on an adhesive layer group(S4). Heat and pressure are applied to one side of the chip(S5). The chip is bonded on the substrate(S6).