发明名称 PARTIAL SURFACE TREATMENT APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a partial surface treatment apparatus which hardly decrease sealability of an elastic sealant against an outer circumferential surface of an object to be treated and treatment efficiency in surface treatment. <P>SOLUTION: The partial surface treatment apparatus includes a first electrode member electrically connected to an object to be treated A having a circumferential groove A1 at an outer circumferential surface B thereof, a second electrode member 17 having an annular-shaped inner circumferential surface 31 facing the outer circumferential surface and the circumferential groove while keeping a distance therefrom, an annular non-conductive elastic sealant 40 that can seal a clearance C between the outer circumferential surface and the inner circumferential surface on the two sides of the circumferential groove respectively, an attachment portion 41 where the elastic sealant can be attached all around the outer circumferential surface while keeping a distance from the outer circumferential surface, and a pressure applying mechanism 51 that supplies a pressurized fluid to the outer circumferential side of the attached elastic sealant to press-contact the inner circumferential side of the elastic sealant against the outer circumferential surface over the entire circumference, and can release the press-contact freely. A supply passage through which an electrolyte is supplied to the circumferential groove is opened on the inner circumferential surface. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011219858(A) 申请公布日期 2011.11.04
申请号 JP20100287495 申请日期 2010.12.24
申请人 AISIN SEIKI CO LTD 发明人 KOBAYASHI HIROYUKI;TATSUMOTO KAZUHIRO
分类号 C25D17/08;C25D17/00;C25D17/10 主分类号 C25D17/08
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