| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a wiring board with a built-in semiconductor chip for simplifying a manufacturing process and shortening manufacturing time while connection reliability of the semiconductor chip is improved. <P>SOLUTION: In a lamination process, a semiconductor chip 50 where a stud bump formed of Au is installed in an electrode 51a and a thermosetting resin film 21b where a pad 31 is formed are arranged in a direction where the stud bump 52a and the pad 31 confront each other via a thermoplastic resin film 22b. In a pressurizing/heating process, a CuAu alloy layer 522 being an alloy layer of Cu constituting the pad 31 and Au constituting the stud bump 52a is formed by bonding the pad 31 with the stud bump 52a and the electrode 51a with the stud bump 52a by solid-phase diffusion bonding, and all Al of the electrode 51a are made into AuAl alloy and an AuAl alloy layer 521 which does not include Al is formed. <P>COPYRIGHT: (C)2012,JPO&INPIT |
