| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for testing semiconductor devices, the method capable of measuring waveform without requiring a solder-connection. <P>SOLUTION: A method for testing semiconductor devices uses a semiconductor testing apparatus testing a semiconductor device in a state of opposite connection between contact points 41 of a contract ring 40 connected to a semiconductor device W and terminals of a performance board 31. The method includes steps of: preparing a measuring board 90 having an outer area 92 protruding beyond the contact ring, first terminals 93 opposing the contact points of the contact ring and second terminals 94 opposing the terminals of the performance board on both surfaces of the measuring board 90, and measuring terminals 96 connected to the first terminals and the second terminals in the outer area 92; and arranging the measuring board sandwiched between the contact ring and the performance board to subject the semiconductor device to a measurement testing using the measuring terminal. <P>COPYRIGHT: (C)2012,JPO&INPIT |
