| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device in which an opening part is formed at a sealing member that seals a semiconductor element, in a shorter time. <P>SOLUTION: There are prepared a metal mold in which a projection part is provided on an inner peripheral surface and a sealed member 20 containing IGBT element 21N. The metal mold is arranged around the sealed member 20 so that the projection part and the IGBT element 21N face each other across a predetermined interval (L35) and the IGBT element 21N is sealed up inside the metal mold. A molten resin is filled inside the metal mold. Laser light is irradiated toward the IGBT element 21N from the surface side of a mold resin 11 through a recess 13 formed on the mold resin 11 by the projection part. By this, a contact hole through which a part of the surface of the IGBT element 21N is exposed is formed inside the recess 13. <P>COPYRIGHT: (C)2012,JPO&INPIT |
