发明名称 LEAD FRAME FOR OPTICAL SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING LEAD FRAME FOR OPTICAL SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To assure adhesion and to assure emission efficiency. <P>SOLUTION: A nickel or a nickel alloy plating film 3 and a silver alloy plating film 4a, containing antimony, are stacked on a metal material 2. Over them, a silver plating film 4b is formed at least in a formation region of a reflector 5 by using a low cyan silver plating solution. Thus, adhesion is assured and emission efficiency is assured. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011222680(A) 申请公布日期 2011.11.04
申请号 JP20100089081 申请日期 2010.04.08
申请人 PANASONIC CORP 发明人 KONO KEISHIRO;TAKASAGO KOJI;MUTAJIMA KENJI
分类号 H01L23/48;H01L33/62 主分类号 H01L23/48
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