| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a surface-mount electronic component and a surface-mount electronic component mounting structure capable of maintaining connection reliability with a circuit board to be mounted without reducing the formation area of bumps such as for signal, power and ground. <P>SOLUTION: A surface-mount electronic component 100 comprising: a multi-layered circuit board including an electronic circuit(a plurality of elements such as 11-16, 21 and 22); a plurality of bumps 60 placed on one surface of the multi-layered circuit board and electrically connected to the electronic circuit; and a supporting member 50 made of a material having a higher fusion temperature than the material of the bumps 60, the supporting member 50 having a fixing part 51 fixed to the multi-layered circuit board within the multi-layered circuit board, and having a plurality of supporting parts(a connection part 52 and a contact part 53) which extend from the fixing part 51, are positioned outside a side surface of the multi-layered circuit board in a direction vertical to the thickness direction of the multi-layered circuit board, and reach the location of the bump 60 in the thickness direction of the multi-layered circuit board. <P>COPYRIGHT: (C)2012,JPO&INPIT |
