发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which dries a processing substrate to be processed while pattern collapse is improved and contamination is prevented. <P>SOLUTION: A substrate holding part 34 is carried into a processing container 31 with a processing substrate to be processed W whose surface is wet with liquid placed laterally. A lid member 341 integrally formed with the substrate holding part 34 closes the opening 311 of the processing container 31. Atmosphere formation parts 711 and 39 make the inside of the processing container atmosphere of super critical fluid and then a posture changing mechanism 6 turns the processing substrate to be processed W longitudinally by converting the posture of the processing container 31. Accordingly, the liquid on the top surface of the processing substrate to be processed W flows down to be drained out of discharging ports. After that, a dried processing substrate to be processed is obtained by discharging the super critical fluid out of an exhaust section 731 and decompressing the inside of the processing container 31 to change the super critical fluid into gas. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011222696(A) 申请公布日期 2011.11.04
申请号 JP20100089466 申请日期 2010.04.08
申请人 TOKYO ELECTRON LTD 发明人 KAMIKAWA YUJI
分类号 H01L21/304;H01L21/027 主分类号 H01L21/304
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