AN ETCHING SOLUTION COMPOSITION FOR METAL LAYER COMPRISING COPPER AND TITANIUM

摘要

PURPOSE: An etching solution composition for a metal layer comprising copper and titanium is provided to implement rapid etching of copper without including hydrogen peroxide and/or oxone. CONSTITUTION: An etching solution composition for a metal layer comprising copper and titanium comprises persulfate 5~20 weight%, fluorine compound 0.01~2 weight%, one or more selected among inorganic acid, inorganic acid salt, and their mixture 1~10 weight%, ring-type amino-compound 0.3~5 weight%, chlorine-containing compound 0.1~5 weight%, and water of the remaining amount.