| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a chip size package of a semiconductor which can attain miniaturization and cost reduction by simplification of the package. <P>SOLUTION: An electrode face of a semiconductor element in a wafer 100 state is stuck to one face of a wiring board 41 including electrodes 60 and 61 on both faces. A silicon substrate of the wafer is removed by etching in vicinity of a sticking processing temperature. The electrode 60 on the other face is made to serve as an electrode of the package with the wiring board 41 as a protection material of the element. <P>COPYRIGHT: (C)2012,JPO&INPIT |
