| 摘要 |
<P>PROBLEM TO BE SOLVED: To form a conductor pattern finer than a conventional one in an electronic component and a manufacturing method of the electronic component. <P>SOLUTION: The manufacturing method of the electronic component includes a process for forming a resin layer 6 on a conductor foil 4, a process for pressing a conductor plate 2 where a projected pattern 2w is formed on one main face 2x on the resin layer 6 and embedding the projected pattern 2w in the resin layer 6, a process for forming through holes 6a in the conductor plate 2, the resin layer 6 and the conductor foil 4 respectively, a process for embedding a conductor 11 in the through hole 6a, a process for forming a first conductor pattern 4x which is electrically connected to the conductor 11 by patterning the conductor foil 4 and a process for forming a second conductor pattern 2z which is electrically connected to the first conductor pattern 4x via the conductor 11 in the resin layer 6 by polishing, CMP or grinding the other main face 2y of the conductor plate 2 until the resin layer 6 appears. <P>COPYRIGHT: (C)2012,JPO&INPIT |
