| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a contact pin which fulfills all five requirements: fine releasability from solder ball, low resistance (contact resistance and material resistance), high corrosion resistance and stable contact resistance, hard parent material, and easy machining. <P>SOLUTION: A contact pin 20 with hybrid structure with precious metal plating layer formed on high silicon and extra low carbon stainless steel surface of this invention is a contact pin which uses a pin tip 22 pressed against solder ball, and is formed on a contact pin body 30 manufactured from contact pin material made from precipitation hardening type high silicon and extra low carbon stainless steel which has Si content within the range of 2-5 mass% and C content as impurity of 0.03 mass% or less, and the surface of the contact pin body 30, and has a precious metal plating layer 32 which has higher conductivity than the contact pin body 30. <P>COPYRIGHT: (C)2012,JPO&INPIT |
