| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a prepreg for a printed wiring board having high connection reliability to a mounting component because of a low coefficient of thermal expansion and being excellent in heat resistance. <P>SOLUTION: The prepreg for a printed wiring board is made by impregnating a thermosetting resin varnish containing (e) an inorganic filler of 50-150 wt.% based on organic resin solid within the varnish in glass woven fabric and heating, drying and making the varnish B-staged, the varnish containing as essential ingredients: (a) an epoxy resin having at least two epoxy groups in a molecule; (b) a condensation polymer of phenols and formaldehyde; (c) dicyandiamide; (d) a hardening accelerator; and (e) an inorganic filler, which is 50-150 wt.% for organic resin solid content in the varnish. <P>COPYRIGHT: (C)2012,JPO&INPIT |
