| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing an optical semiconductor element, which is excellent in resistance to gas permeation and in thin film curing property while retaining heat resistance, light resistance and crack resistance. <P>SOLUTION: The epoxy resin composition includes (A) a silicone-modified epoxy compound represented by formula (1) (wherein R<SP POS="POST">2</SP>is a group containing a specified glycidyl isocyanurate and X is a monovalent group containing a chain of the formula (1)), (B) a curing agent in an amount of 0.5-1.5 equivalent to one equivalent of the epoxy group contained in the component (A), and (C) a polyhydric alcohol in an amount of 0.01-1.0 equivalent to one equivalent of the curing agent (B). <P>COPYRIGHT: (C)2012,JPO&INPIT |
