| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electrostatic chuck with a thin bond, high heat conductivity, and components which do not easily crack. <P>SOLUTION: An electrostatic chuck comprises: a ceramic dielectric which has an electrode on the surface; a ceramic substrate which supports the ceramic dielectric; a first bond to glue the ceramic dielectric and the ceramic substrate. The first bond has a base compound containing organic material, a formless filler containing inorganic material, and a sphere-shaped filler containing inorganic material. Mixed in the first base compound are the first formless filler and the first sphere-shaped filler. The first base compound, the first formless filler, and the first sphere-shaped filler are composed of electric insulation material. The average diameter of the first sphere-shaped filler is larger than the maximum value of the breadth of the first formless filler, and the thickness of the first bond is the same as the average diameter of the first sphere-shaped filler or larger. <P>COPYRIGHT: (C)2012,JPO&INPIT |
