| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a high-frequency package which prevents high-frequency signals from leaking from inside the package to the outside and a method for manufacturing the same. <P>SOLUTION: The high-frequency package comprises a multilayer board 1; a MMIC4 mounted on the multilayer board 1; a conductor pattern 2 which is nearly loop-shaped encircling an area on the multilayer board 1 in which area the MMIC4 is mounted and includes at least one notch in pattern 3 for forming a ventilation hole where the surface of the multilayer board 1 is exposed; a metal cover 5, of a rectangular shape as viewed from above, which is shaped so as to form a cavity between itself and the multilayer board 1 and whose joining face with the conductor pattern 2 is loop-shaped; and a solder bonding layer which bonds the conductor pattern 2 and the metal cover 5 and has a ventilation hole in an discontinuous part of the conductor pattern 2 which is formed by absence of solder between itself and the joining face of the metal cover 5, wherein the ventilation hole is formed at a position whose distance from an edge of the metal cover 5 is an integral multiple of the half wavelength of electromagnetic waves, leakage of which from the cavity is to be prevented. <P>COPYRIGHT: (C)2012,JPO&INPIT |
