| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board capable of forming a conductive film of good conductivity with less damage. <P>SOLUTION: A metal microparticle dispersion ink 102 in which the conductive material on which an organic material is coated is dispersed in a dispersion solvent is applied to a conductive film formation planned position P on a substrate 101. The dispersion solvent of the metal microparticle dispersion ink 102 applied on the substrate 101 is caused to vaporize to form a deposition film 102A of the conductive material. The deposition film 102A is covered with a protective film 103 which is mixed with a foam capsule that is foamed under heat, thus the deposition film 102A is protected when an object E to be removed is etched. After the object E to be removed is etched, the substrate 101 is baked so that the foam capsule of the protective film 103 is foamed to form many ventilation holes 105 and releases the gas of the organic material contained in the conductive material of the deposition film 102A through the ventilation holes 105. Thus, the gas is released from the deposition film 102A to form a conductive film 102B. <P>COPYRIGHT: (C)2012,JPO&INPIT |
