| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a ceramic package and a manufacturing method of the same as well as a ceramic module that do not impair the hermetic seal performance of a semiconductor bare chip when the ceramic package is mounted onto a mother board. <P>SOLUTION: The ceramic package includes a ceramic circuit board 1, a semiconductor bare chip 2 mounted on the ceramic circuit board 1, a seal ring land 5 on the ceramic circuit board 1 for enclosing a region on which the semiconductor bare chip 2 is mounted, a seal ring 4 which is ultrasonically welded on the seal ring land 5, and a cover 9 joined to the edge of the seal ring 4. <P>COPYRIGHT: (C)2012,JPO&INPIT |
