| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic device that has a heat dissipation structure and is capable of preventing a malfunction and destruction of an integrated circuit chip due to static electricity accumulated from outside. <P>SOLUTION: The electronic device has a connector 232 that electrically connects a heat emitting part 23 having conductivity and a conductive part of a substrate 200. Thanks to the connector 232 if, for example, static electricity is accumulated in the heat emitting part 23 from outside, current in connection with discharge of the static electricity flows through the connector 232 to the conductive part (ground potential) of the substrate 200. <P>COPYRIGHT: (C)2012,JPO&INPIT |
