发明名称 |
Methodologies and Test Configurations for Testing Thermal Interface Materials |
摘要 |
Methodologies and test configurations are provided for testing thermal interface materials and, in particular, methodologies and test configurations are provided for testing thermal interface materials used for testing integrated circuits. A test methodology includes applying a thermal interface material on a device under test. The test methodology further includes monitoring the device under test with a plurality of temperature sensors. The test methodology further includes determining whether any of the plurality of temperature sensors increases above a steady state.
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申请公布号 |
US2011267082(A1) |
申请公布日期 |
2011.11.03 |
申请号 |
US20100771138 |
申请日期 |
2010.04.30 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
FREGEAU DUSTIN;GARDELL DAVID L.;KOSBAR LAURA L.;STEVENS KEITH C.;WAGNER GRANT W. |
分类号 |
G01R31/02;G01R31/10 |
主分类号 |
G01R31/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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