| 摘要 |
A packaged thermoelectric conversion module that does not need a pressing mechanism for reducing a thermal contact resistance or an application of a thermal-conductive grease between a heat source of a thermoelectric conversion module sealed in an airtight container, wherein an interior of an airtight container 13 containing a thermoelectric conversion module 5 is decompressed or evacuated, wherein the interior of the airtight container 13 is partitioned into two chambers 14 and 17 by a partition plate 7, wherein one chamber 17 is provided with the thermoelectric conversion module 5 and electrodes 9a and 9b led out to the outside of the airtight container 13, while the other chamber 14 is provided with a flow path 16 for introducing a thermal medium 26 or 25 from an external thermal medium supplying source and circulating the thermal medium 26 or 25 between the chamber 14 and the external thermal medium supply source, and heat is transferred to or received from one surface of the thermoelectric semiconductor 2 by the thermal medium 26 or 25 via the partition plate 7, while heat is transferred or received between the other surface of the thermoelectric semiconductor 2 and an external heat source via the airtight container 13.
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