The present invention relates to a MEMS microphone package which improves a sound characteristic by forming an additional chamber with a photo solder resist (PSR) dam on a PCB to expand a back chamber. The MEMS microphone package of the present invention comprises: a MEMS microphone chip; the PCB on which the additional chamber is formed with the PSR dam of a predetermined height at a position in which the MEMS microphone chip is mounted; and a case which is coupled with the PCB to form a space in which the components are stored, and is characterized in that a back chamber space of the MEMS microphone chip is expanded by the additional chamber. The additional chamber is manufactured by hardening PSR ink after forming a shape of a rectangular ring with the PSR ink for preventing the attachment of solder on an unnecessary part in a PCB manufacturing process and protecting surface circuits from the external environment. The present invention can improve sensitivity and can improve noise such as total harmonic distortion (THD) and the like by forming the additional chamber with the PSR dam and attaching the MEMS microphone chip thereon to increase the insufficient back chamber space of the MEMS chip.
