PACKAGE FOR SEMICONDUCTOR LIGHT EMITTING DEVICE, AND LIGHT EMITTING DEVICE

摘要

Disclosed is a package, which is resistant to the heat generated by a semiconductor light emitting element, and from which a metal wiring line or the like is not easily separated. Specifically disclosed is a package for a semiconductor light emitting device, which comprises at least a resin molded body that contains (A) a polyorganosiloxane containing SiH and (B) a filler. The package for a semiconductor light emitting device is characterized in that the amount of SiH present in the resin molded body after heating the resin molded body at 200°C for 10 minutes is 20-65 µmol/g.