METHOD OF MOUNTING DEVICES IN SUBSTRATE AND DEVICE-MOUNTING SUBSTRATE STRUCTURE THEREOF

摘要

PURPOSE: A method for mounting a device on a substrate and a structure of a substrate on which a device is mounted are provided to combine a wiring substrate with a device electrode by electroplating. CONSTITUTION: A metal wiring layer(4) is placed on a substrate. The metal wiring layer comprises an opening. A thermosetting resin layer(6) is formed on at least a part of the substrate on which the opening of the metal wiring layer is overlapped. A device(3) is located on the resin layer. The device is located on the top of the opening of the metal wiring layer.