发明名称 |
SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTURING METHOD |
摘要 |
A plated film having a uniform film thickness is formed on a surface of a substrate. A semiconductor manufacturing apparatus includes: a holding mechanism for holding a substrate rotatably; a nozzle for supplying a processing solution for performing a plating process on a processing target surface of the substrate; a substrate rotating mechanism for rotating the substrate held by the holding mechanism in a direction along the processing target surface; a nozzle driving mechanism for moving the nozzle in a direction along the processing target surface at a position facing the processing target surface of the substrate held by the holding mechanism; and a control unit for controlling the supply of the processing solution by the nozzle and the movement of the nozzle by the nozzle driving mechanism.
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申请公布号 |
US2011265718(A1) |
申请公布日期 |
2011.11.03 |
申请号 |
US201113180702 |
申请日期 |
2011.07.12 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
HARA KENICHI;IWASHITA MITSUAKI;TANAKA TAKASHI;TOSHIMA TAKAYUKI;ORII TAKEHIKO |
分类号 |
B05B13/04;B05C11/10;H01L21/00 |
主分类号 |
B05B13/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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