COPPER AND TITANIUM COMPOSITION FOR METAL LAYER ETCHING SOLUTION

摘要

The present invention relates to a copper and titanium composition for a metal etching solution, comprising the following, based on the total weight of the composition: 5 to 20 wt % of persulfate; 0.01 to 2 wt % of a fluorine compound; 1-10 wt % of an additive containing one or more acids selected from inorganic acids, salts of inorganic acids, and a mixture thereof; 0.3 to 5 wt% of a cyclic amine compound; 0.01 to 8 wt % of an additive containing one or more compounds selected from a chlorine compound and cupric salts; and with the remainder being water.